NXP Semiconductors N.V.

NXP Semiconductors N.V. is a global semiconductor company with over 70 years of experience in the industry. The company provides solutions in the domains of cryptography-security, high-speed interface, radio frequency (RF), mixed-signal analog-digital (mixed A/D), power management, digital signal processing and embedded system design. NXP's business strategy focuses on providing leading solutions in the automotive, industrial & IoT, mobile, and communication infrastructure & other end markets. The company has a reportable segment representing the entity as a whole. NXP's website is [www.nxp.com](http://www.nxp.com), and its ticker symbol is NXPI. The semiconductor market totaled $527 billion in 2023, and NXP has a strong focus on mobile wallet, Ultra-Wideband (UWB), and specialty custom analog solutions. The growth in the mobile market is mainly driven by the increasing attach rate of these features across devices, vendors, and regions. UWB is gaining momentum as a secure, fine-ranging technology capable of enabling a wide range of innovative location-based user experiences. NXP is well positioned in this market. NXP offers a broad portfolio of semiconductor products, including microcontrollers, application processors, communication processors, connectivity chipsets, analog and interface devices, RF power amplifiers, security controllers, and sensors. The company's microcontrollers integrate all major components of a computing system onto a single semiconductor device and provide the digital logic or intelligence for electronic applications. Application processors consist of a computing core with embedded memory and special-purpose hardware and software for secure multimedia applications. Communication processors combine a computing core, caches, and other memories with high-speed networking and input/output interfaces. NXP also offers a broad portfolio of connectivity solutions, including Near Field Communications (NFC), Ultra-wideband (UWB), Bluetooth low-energy (BLE), Zigbee, Thread, and Wi-Fi and Wi-Fi/Bluetooth integrated SoCs. The company manufactures semiconductors through a combination of wholly owned manufacturing facilities, a manufacturing facility operated jointly with another semiconductor company, and third-party foundries and assembly and test subcontractors. NXP primarily focuses its internal and joint venture wafer manufacturing operations on running proprietary specialty process technologies that enable it to differentiate its products on key performance features. The company also increasingly focuses its in-house manufacturing on its competitive 8-inch wafer facilities, which predominantly run manufacturing processes in the 140 nanometer, 180 nanometer, and 250 nanometer process nodes. NXP's front-end manufacturing facilities use a broad range of production processes and proprietary design methods, including complementary metal oxide semiconductor (CMOS), bipolar, bipolar CMOS (BiCMOS), and double-diffused metal on silicon oxide semiconductor (DMOS) technologies. The back-end manufacturing facilities test and package many different types of products using a wide variety of processes. NXP's major front-end and back-end facilities include those in Singapore, Nijmegen, Austin, Chandler, and Austin (Ed Bluestein), among others.