AMKOR TECHNOLOGY, INC.

Amkor Technology, Inc. (NASDAQ: AMKR) operates as the world's largest U.S. headquartered outsourced semiconductor assembly and test service provider. The company delivers comprehensive packaging and test solutions that enable leading semiconductor and electronics manufacturers to bring advanced technologies to market. Amkor's website is www.amkor.com.

The company provides turnkey packaging and test services including wafer bump, wafer probe, wafer back-grind, package design, packaging, burn-in, system level and final test services. Its Advanced Products segment, representing 82.8 percent of 2025 net sales of $6.7 billion, encompasses flip chip, memory, and wafer-level processing technologies. The Mainstream Products segment comprises wirebond packaging and power device packaging solutions. Advanced system-in-package modules generated approximately $3.1 billion in annual sales, combining multiple semiconductor and electronic components into single packages for applications ranging from smartphones to data centers.

Amkor serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. The company's end market distribution reflects significant exposure to communications devices at 46 percent of sales, computing applications at 20 percent, automotive and industrial at 19 percent, and consumer electronics at 15 percent. Apple and Qualcomm represent major customers, accounting for 29.8 percent and 11.1 percent of 2025 net sales respectively, with the ten largest customers representing 72 percent of total sales.

The company operates a geographically diverse manufacturing footprint spanning 12 countries across Asia-Pacific, Europe, and the United States, with approximately 30,800 employees as of December 31, 2025. Amkor is expanding its U.S. presence through construction of a new facility in Arizona while scaling production at its Vietnam facility opened in 2024. The company maintains technology leadership through substantial research and development investments focused on heterogeneous integration, wafer-level packaging, copper hybrid bonding, co-packaged optics, and advanced automotive packaging solutions. Amkor's competitive positioning derives from advanced packaging technology, manufacturing scale and expertise, customer co-development capabilities, quality and reliability, and disciplined capital investment strategies.